Rosfix Flux In Syringe Nc-559-Asm + Soldering Paste (Liquid Tin) Xgsp80 60G

Rosfix Kit: NC-559-ASM Flux Syringe + XGSP80 Solder Paste (Liquid Tin) 60g This kit from Rosfix, consisting of NC-559-ASM flux syringe and 60g XGSP80 solder paste, is the ideal solution for electronics and soldering professionals and hobbyists. It ensures excellent solder joint quality and ease of use. Flux in Syringe NC-559-ASM : Precise Application : Thanks to the convenient syringe form, flux can be applied exactly where it is needed, which is crucial for precision soldering work. Increased Adhesion : NC-559-ASM flux is designed to improve solder properties, resulting in strong and durable joints, while minimizing the risk of thermal damage. Solder Paste (Liquid Tin) XGSP80 : High tin content : XGSP80 solder paste contains a high amount of tin, which allows for solid and reliable solder joints, ideal for repairing and assembling electronic components. Excellent performance properties : The paste ensures even distribution and quick adhesion to the soldered surfaces, which is essential when working with delicate and small components. Advantages of the Rosfix kit : Versatility of applications : Perfect for both electronics repairs and precise assembly of new systems. Ease of use : Thanks to the syringe form and optimal paste consistency, the kit is easy to use even for less experienced users. Professional quality : Ensures high quality and durability of welds, which is crucial for long-term and reliable operation of electronic devices. This kit is ideal for use in professional workshops and at home where precise and durable solder joints are required. NC-559-ASM 10cc Flux Syringe No-clean type : NC-559-ASM is a no-clean type, which means it does not require particularly thorough cleaning after the soldering process. Gel consistency: The flux has a gel consistency, which makes it easy to apply, and its thick form facilitates precise application. Easy cleaning: Flux residues can be easily removed with cleaning fluids such as isopropanol. Ideal for reballing and soldering BGA and SMD components: Thanks to the appropriate viscosity, this flux is ideal for advanced soldering techniques such as reballing, as well as for soldering BGA and SMD components. Easy spreading: This flux spreads easily, which facilitates the soldering process and ensures even surface coverage. High Intensity: It has high intensity, which means it is effective in wetting the solder surface, which is crucial for successful soldering. High Intensity and Wettability : NC-559-ASM stands out for its high intensity and wettability of the solder surface. This guarantees precise and durable connections during the soldering process. Applications in Repair and Manufacturing: This flux is indispensable when repairing damaged electronic components, such as solder balls or BGA chips in cell phones. Its properties do not impair the function of ICs and PCBs, ensuring safe and professional results. Electronic Component Protection: A key advantage of this flux is that it does not degrade the properties of electronic components such as ICs or PCBs. This means that the connections are not only durable, Preventing Melted Solder from Sticking: This flux is designed to prevent molten solder from sticking. This allows you to maintain clarity and accuracy in your work, even during the most difficult tasks. Rosfix Solder Paste (liquid tin) XGSP80 60g No Clean: No need for washing after soldering, increases process efficiency. Silver Formula: New formula with silver for excellent soldering efficiency. Use in GSM and BGAP stencils: Ideal for GSM and BGAP stencils technology, ensures the desired representation of solder pads on BGA systems. Pre-Coating of BGA Pads with Lead Tin: Perfect for pre-soldering BGA pads with lead tin. Easy Application and Activation: Easy application, activated by heating to 183°C. No Washing Required after Soldering/Reflow: No washing required after the finished process. Storage at 0°C - 10°C: Retention of properties when stored at appropriate temperature. Resin and Solvent Based Flux: Contains resin and solvent-based flux for effective soldering. ‼ Our offer also includes spatulas for spreading the paste. ‼ Specification: Melting point: 183°C Weight: 60g Alloy: Sn63 / Pb37 Particle size: 25-38 µm Viscosity: 50 (Pa S)